Power supply system and semiconductor package assembly

ABSTRACT

An electronic device and a semiconductor package structure are provided. The device includes a plurality of semiconductor dies stacked vertically over each other and a power supply system. The semiconductor dies are stacked over the power supply system. The power supply system includes: a voltage generating circuit configured to generate at least one voltage. The at least one voltage is provided to the plurality of semiconductor dies through a power interconnecting structure. The semiconductor package structure includes a package substrate; at least one semiconductor die disposed on the package substrate; and the power supply system disposed on the package substrate. The at least one semiconductor die may include a plurality of semiconductor dies vertically stacked on the package substrate.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation application of International PatentApplication No. PCT/CN2019/108429, filed on Sep. 27, 2019, which isbased on and claims priority of the Chinese Patent Applications No.201811132440.7 and No. 201821612292.4, both filed on Sep. 27, 2018. Theabove-referenced applications are incorporated herein by reference intheir entirety.

TECHNICAL FIELD

The present disclosure relates to the technical field of semiconductortechnologies and, more specifically, to a power supply system and asemiconductor package structure.

BACKGROUND

With the technical advancement in mobile consumer electronic devices,such as cellular phones, notebook computers and personal digitalassistants, the demand for memory devices with compact structures andhigh performance has substantially increased. Modern developments insemiconductor memory devices can be viewed as a process of maximizingthe storage capacity at the smallest area on a memory device at aspecific operating speed. In this context, the term “smallest” generallyrefers to the smallest area occupied by a memory device in a“horizontal” X/Y plane (e.g., a plane defined by a main surface of aprinted circuit board or template board). In general, the allowablehorizontal area occupied by the memory device is limited, thus memorydevices with vertically integrated structures are developed so that thestorage capacity of the devices may be further increased.

It is to be understood that the above information is only used tofacilitate understanding the background of the present disclosure, andthus may include information that does not constitute prior art known toa person of ordinary skill in the art.

SUMMARY

One aspect of the present disclosure is directed to an electronicdevice. The device may comprise: at least one semiconductor dies and apower supply system. The power supply system may comprise a voltagegenerating circuit configured to generate at least one voltage. Thevoltage generating circuit may comprise at least one voltage regulatorconfigured to generate the at least one voltage, which may be providedto the at least one semiconductor die through a power interconnectingstructure.

In some embodiments of the present disclosure, the at least one voltageis an internal voltage for the at least one semiconductor die.

In some embodiments of the present disclosure, the at least onesemiconductor die may include a plurality of semiconductor dies stackedover each other.

In some embodiments of the present disclosure, the at least one voltageregulator may comprise a first charge pump circuit, a second charge pumpcircuit, a third charge pump circuit, a first low dropout linearregulator, a second low dropout linear regulator, and a third lowdropout linear regulator. The first charge pump circuit, the secondcharge pump circuit, and the third charge pump circuit may be configuredto output, respectively, a first voltage, a second voltage, and a thirdvoltage according to an external voltage.

The first low dropout linear regulator, the second low dropout linearregulator, and the third low dropout linear regulator may be configuredto output, respectively, a fourth voltage, a fifth voltage, and a sixthvoltage according to the external voltage. The first voltage may belarger than the external voltage, and the second voltage and the thirdvoltage may both be opposite to the external voltage in polarity. Thefourth voltage, the fifth voltage, and the sixth voltage may each beless than or equal to the external voltage.

In some embodiments, in the aforementioned device, the power supplysystem may further comprise a reference voltage generating circuitconfigured to generate a reference voltage. The at least one voltageregulator may be configured to output, respectively, the first voltage,the second voltage, the third voltage, the fourth voltage, the fifthvoltage, and the sixth voltage according to the external voltage, thereference voltage, and a power enable signal.

In some embodiments of the present disclosure, the at least one voltageregulator may comprise a first low dropout linear regulator, a firstcharge pump circuit, a second charge pump circuit, a second low dropoutlinear regulator, a third low dropout linear regulator, and a fourth lowdropout linear regulator.

The first low dropout linear regulator, the second low dropout linearregulator, the third low dropout linear regulator, and the fourth lowdropout linear regulator may be configured to output, respectively, afirst voltage, a fourth voltage, a fifth voltage, and a sixth voltageaccording to an external voltage.

The first charge pump circuit and the second charge pump circuit may beconfigured to output, respectively, a second voltage and a third voltageaccording to the external voltage. The first voltage, the fourthvoltage, the fifth voltage, and the sixth voltages may each be less thanor equal to the external voltage. The second voltage and the thirdvoltage may both be opposite to the external voltage in polarity.

In some embodiments, in the aforementioned device, the power supplysystem may further comprise a reference voltage generating circuitconfigured to generate a reference voltage. The at least one voltageregulator may be configured to output, respectively, the first voltage,the second voltage, the third voltage, the fourth voltage, the fifthvoltage, and the sixth voltage according to the external voltage, thereference voltage, and a power enable signal.

Another aspect of the present disclosure is directed to a semiconductorpackage structure. The semiconductor package structure may comprises: apackage substrate; at least one semiconductor die disposed on thepackage substrate; and the power supply system of any of theaforementioned embodiments. The power supply system may be disposed onthe package substrate.

In some embodiments of the present disclosure, in the aforementionedsemiconductor package structure, the at least one semiconductor die maycomprise a plurality of semiconductor dies, each having a sameelectrical function.

In some embodiments of the present disclosure, in the aforementionedsemiconductor package structure, the plurality of semiconductor dies maybe memory dies.

In some embodiments of the present disclosure, in the aforementionedsemiconductor package structure, the plurality of semiconductor dies maybe dynamic random-access memory (DRAM) dies.

In some embodiments of the present disclosure, in the aforementionedsemiconductor package structure, the plurality of semiconductor dies maybe stacked vertically on the power supply system.

In some embodiments of the present disclosure, in the aforementionedsemiconductor package structure, the power interconnecting structure maycomprise a through silicon via (TSV).

In some embodiments of the present disclosure, in the aforementionedsemiconductor package structure, the plurality of semiconductor dies maybe individually disposed on the package substrate directly, and thepower supply system may be directly disposed on the package substrate.

In some embodiments of the present disclosure, in the aforementionedsemiconductor package structure, the power interconnecting structure maycomprise a metal wire.

In some embodiments of the present disclosure, in the aforementionedsemiconductor package structure, the plurality of semiconductor dies maybe vertically stacked on the package substrate, and the power supplysystem may be directly disposed on the package substrate.

In some embodiments of the present disclosure, in the aforementionedsemiconductor package structure, a diameter of the power interconnectingstructure may depend on a number of the at least one semiconductor die.

In some embodiments of the present disclosure, the aforementionedsemiconductor package structure may further comprise a signalinterconnecting structure. The signal interconnecting structure may beconfigured to input an external control signal to each of the at leastone semiconductor die and/or input a data signal to or receive a datasignal from each of the at least one semiconductor die through thepackage substrate.

In some embodiments of the present disclosure, in the aforementionedsemiconductor package structure, each of the at least one semiconductordie and the power supply system may share a ground power source providedby the package substrate.

In some embodiments of the present disclosure, in the aforementionedsemiconductor package structure, a package size of the power supplysystem may be smaller than or equal to a package size of each of the atleast one semiconductor die.

BRIEF DESCRIPTION OF THE DRAWINGS

The various objectives, features and advantages of the presentdisclosure will become more apparent after reading the DetailedDescription of the Embodiments in view of the accompanying drawings. Thedrawings are only illustrative diagrams of the present disclosure andare not necessarily drew to scale. In the drawings, the same referenceindicates the same or similar parts.

FIG. 1 is a schematic structural diagram of a semiconductor packagestructure in the related art.

FIG. 2 is a schematic structural diagram of another semiconductorpackage structure in the related art.

FIG. 3 is a schematic structural diagram of a semiconductor die in therelated art.

FIG. 4 is a schematic structural diagram of a semiconductor packagestructure in accordance with one embodiment of the present disclosure.

FIG. 5 is a schematic structural diagram of another semiconductorpackage structure in accordance with one embodiment of the presentdisclosure.

FIG. 6 is a schematic structural diagram of a power supply system inaccordance with one embodiment of the present disclosure.

FIG. 7 is a sequence diagram of the power supply system shown in FIG. 6.

FIG. 8 is a circuit diagram of a charge pump circuit based on thevoltage Vp of the power supply system shown in FIG. 6.

FIG. 9 is a sequence diagram of the charge pump circuit based on thevoltage Vp shown in FIG. 8.

FIG. 10 is a circuit diagram of the generation of the voltage Vpclkshown in FIG. 8.

FIG. 11 is a circuit diagram of the generation of the voltage Vpclkenshown in FIG. 10.

FIG. 12 is a circuit diagram of a charge pump circuit based on thevoltage Vbb of the power supply system shown in FIG. 6.

FIG. 13 is a circuit diagram of a charge pump circuit based on thevoltage Vnwl of the power supply system shown in FIG. 6.

FIG. 14 is a circuit diagram of a low dropout linear regulator based onthe voltage Vcore of the power supply system of FIG. 6.

FIG. 15 is a circuit diagram of a low dropout linear regulator based onthe voltage Veq of the power supply system of FIG. 6.

DETAILED DESCRIPTION OF THE EMBODIMENTS

Exemplary embodiments embodying the features and advantages of thepresent disclosure will be described in detail in the followingdescription. It should be understood that the present disclosure can bemodified based on various embodiments, which will not go beyond thescope of the present disclosure. Description and Drawings are not usedfor limiting but illustrating the present disclosure.

In the following description of the various exemplary embodiments of thepresent disclosure, reference is made to the drawings which are parts ofthe disclosure, and some different exemplary structures, systems andsteps according to various aspects of the disclosure are provided. It isunderstood that other specific components, structures, exemplarydevices, systems and steps may be employed, and structural andfunctional modifications may be made without departing from the scope ofthe disclosure.

FIG. 1 is a schematic structural diagram of a semiconductor packagestructure in the related art.

As shown in FIG. 1, a plurality of semiconductor dies (for example, thesemiconductor memory dies A-D in FIG. 1) may be vertically stacked in avertical plane Z relative to a horizontal plane X/Y. For example, thedie A may be arranged on top of the die B, the die B may be arranged ontop of the die C, and the die C may be arranged on top of the die D.

A stacked semiconductor package structure may be one type ofthree-dimensional (3D) integrated circuit (IC). In other words, from aperspective of other systems (such as memory controllers),three-dimensional memory devices may act as integrated memory devices.The data writing and reading operations may be performed by the 3Dmemory device so that data writing and reading methods that aregenerally applicable to non-stacked memory devices (2D memory devices)may be used for 3D memory device. Compared to non-stacked memorydevices, 3D memory devices are capable of storing a larger amount ofdata on a unit area of horizontal surface area.

As shown in FIG. 1, a semiconductor package structure 100 having aplurality of stacked semiconductor dies may include a package substrate101 and semiconductor dies A-D, which may be stacked on the packagesubstrate 101 successively.

Each semiconductor die may have a peripheral region on which electrodepads 102 may be disposed. The electrode pads 102 of the semiconductordies A-D may be interconnected with electrode pads (not shown) on thepackage substrate 101 by bonding wires 103.

In the semiconductor package structure 100 shown in FIG. 1, the width ofeach electrode pad 102 should be about or more than 100 μm in order toachieve a reliable connection between the bonding wire 103 and theelectrode pad 102. In addition, the distance between neighboringelectrode pads 102 (the pitch) cannot be too small. As a result, thenumber of electrode pads 102 provided on the semiconductor die may belimited. Moreover, the bonding wires 103 may increase the totalhorizontal area occupied by the stacked devices, and an intermediatelayer, such as a Re-Distribution Layer (RDL) 104, may need to beprovided between adjacent semiconductor dies in the stack.

If the semiconductor dies A-D are Dynamic Random Access Memory (DRAM)dies, a large number of signal terminals, such as the address signalterminal, command signal terminal and data line terminal, should beprovided with electrode pads 102, in addition to the power supplyterminal and the ground terminal. Therefore, the number of electrodepads 102 that can be assigned to the power supply terminal and theground terminal may be limited.

FIG. 2 is a schematic structural diagram of another semiconductorpackage structure in the related art.

In FIG. 2, a 3D integrated circuit based on Through Silicon Via (TSV) isformed by vertically stacking multiple layers of dies with TSVstherethrough to achieve interconnection between dies for datacommunication. Thus, in addition to the horizontal area defined by theperiphery of the largest die in the stack, no additional horizontal areaneeds to be occupied. In addition, TSVs may reduce the overall length ofcertain signal paths through the stacked structure of devices, thushelping to speed up operations. Thus, with the use of TSVs or similarstacking processes, devices, such as memory devices, formed by multiplevertically stacked dies can use a single integrated circuit with arelatively small horizontal surface area to store and provide largeamounts of data.

As shown in FIG. 2, the semiconductor package structure 200 may have aplurality of semiconductor dies A-D of the same size. The plurality ofsemiconductor dies A-D may be stacked one above another through aplurality of TSVs 202 and electrode pads 203, thereby achievingelectrical connection between the semiconductor dies. This technique canreduce the size of the semiconductor package structure since it is notnecessary to provide solder pads for each bonding wire.

The semiconductor package structure 200 of FIG. 2 may be a DRAM device.Specifically, the semiconductor package structure 200 may include apackage substrate 201 and four DRAM dies A-D successively stacked on thepackage substrate 201. In the DRAM dies and the periphery regions of thepackage substrate 201, a plurality of TSVs 202 may be formed passingthrough the semiconductor dies from the top DRAM die to the bottom DRAMdie along the Z direction.

FIG. 3 is a schematic structural diagram of a semiconductor die in therelated art.

FIG. 3 is a schematic diagram of a single layer of DRAM die in thesemiconductor package structure 200 as shown in FIG. 2. The DRAM diesA-D in FIG. 2 may each have the same ports or pins. For example, theseports or pins may include: BA0-2 (Bank Sel), A0-15 (Address signal),RAS/, CAS/, WE/(Command control signal), CLK, CLK/(clock signal), CS/,RESET/(reset signal), DQ[0:15] (data signal), and signals of theexternal power supplies VDD, VDDQ, VSS, VSSQ, VPP, etc. These ports orpins may be connected to the TSVs, metal wires or RDLs and may also beconnected to package balls (PINs).

Each of the control signals or address signals, such as Bank Sel,Address, Command, CLK, RESET/, may be electrically connected to and passthrough each layer of the DRAM dies A-D. Signals of the external powersupplies such as VDD, VDDQ, VSS, VSSQ, and VPP may be each electricallyconnected to and pass through each layer of the DRAM dies A-D.

DRAM memory cell array 301 may include a plurality of individual memorycells arranged corresponding to a matrix formed by signal lines arrangedin rows and columns. Each memory cell may be capable of storing “writedata” in response to a write command and providing “read data” inresponse to a read command received from an external device (not shown)such as a memory controller or processor. The read or write command maygenerate certain control signals (e.g., row address, column address,enable signal, etc.), which may be applied to, along with certaincontrol voltages, the memory cell array 301 through associatedperipheral devices (e.g., row decoder 302 and column decoder 303).

During a write operation, the “write data” (i.e., data to be stored inmemory cell array 301) may be transmitted from an external circuit(e.g., external memory, external input device, processor, memorycontroller, memory switch, etc.) to a data register. Once stored in thedata register, the “write data” may be written into the memory cellarray 301 by conventional structures and techniques, which may include,for example, sense amplifiers and write driver circuits.

During a read operation, the applied control voltage and the controlsignal outputs from row decoders 302 and column decoders 303 maytypically cooperate to identify and select one or more memory cells inthe memory cell array 301 and facilitate providing signals indicatingthe value of the data stored in the memory cells. The resulting “readdata” may typically be transmitted by a read sense amplifier and storedin a data register. The “read data” stored in the data register then maybe supplied to external circuits under the control of the read controlcircuit.

As shown in FIG. 3, each layer of DRAM dies in FIG. 2 may include alllogical blocks related to the DRAM operations, such as write/readcontrol logic, refresh control, and power supply (e.g., Vp, Vbb, Vnwl,Vcore, Veq, Vplt, etc.). The power supply may need to be adjusted by thecorresponding charge pump circuit or voltage regulator to obtain adesired voltage level.

Each layer of the DRAM dies in the semiconductor package structure 200shown in FIG. 2 may include a respective charge pump circuit and avoltage regulator. That is, the DRAM dies A-D may each have the sameinternal power supply circuit. Since the DRAM dies may need to befabricated by advance nano-scale processes, and the power supply dies(Power IC) generally can be fabricated by micro-scale processes, thedifference between the two processes, in term of feature size, may be upto 1000 times. If the power supply die is integrated in the DRAM dies,the efficiency of the power supply die may reduce (e.g., from 90% to 60%or so) since the manufacturing process for the DRAM dies may not besuitable for the power supply die. In addition, integrating the powersupply die into the DRAM dies will occupy the die area and increase thecost of the DRAM dies. Moreover, the manufacturing process of the DRAMdies is an expensive process, while the manufacturing process of thepower supply is relatively low in cost.

FIG. 4 is a schematic structural diagram of a semiconductor packagestructure in accordance with one embodiment of the present disclosure.

As shown in FIG. 4, this disclosure provides a semiconductor packagestructure 400. The semiconductor package structure 400 may include: apackage substrate 401; a power supply system 402 which may be disposedon the package substrate 401; and at least one semiconductor die. Inthis embodiment, four semiconductor dies A-D may be provided as anexample, but number of dies can be adjusted according to specific needs,and the present disclosure is not limited thereto.

In some embodiments, the at least one semiconductor die may include aplurality of semiconductor dies, and each of the plurality ofsemiconductor dies may have same electrical functions.

In some embodiments, the plurality of semiconductor dies may be memorydies.

In some embodiments, the plurality of semiconductor dies may be DRAMdies. The semiconductor die, however, may be any type of die, and thisdisclosure is not limited thereto.

In the embodiment shown in FIG. 4, the plurality of semiconductor diesmay be vertically stacked on the power supply system 402 successively.For example, the DRAM die A may be vertically stacked on the DRAM die B,and the DRAM die B may be vertically stacked on the DRAM die C, and theDRAM die C may be vertically stacked on the DRAM die D.

In the embodiment shown in FIG. 4, the power supply system 402 may send,through TSVs 403 acting as power interconnecting structure, the internalvoltages to the respective semiconductor dies.

It should be noted that FIG. 4 only shows one embodiment in which aplurality of semiconductor dies is vertically and successively stackedon the power supply system. In other embodiments, each of the pluralityof semiconductor dies may be directly disposed on the package substrate401. That is, the semiconductor dies may be arranged adjacent to eachother in the horizontal plane of the package substrate 401 (i.e.,side-by-side arrangement), and the power supply system may also bedirectly disposed on the package substrate 401. In other embodiments,the plurality of semiconductor dies may be vertically and successivelystacked on the package substrate 401, and the power supply system may bedirectly disposed on the package substrate 401.

In the embodiments in which the semiconductor dies are arranged adjacentto each other in the horizontal plane of the package substrate 401, thepower supply system 402 may send, through metal wires acting as powerinterconnecting structures, the internal voltages to the respectivesemiconductor dies.

FIG. 5 is a schematic structural diagram of another semiconductorpackage structure in accordance with one embodiment of the presentdisclosure.

As shown in FIG. 5, at least one internal voltage output from the powersupply system 402 may be input to each layer of the DRAM dies A-Dthrough the corresponding TSVs 403, respectively. Three arrows shown inFIG. 5 are for illustration purpose only and are not intended to limitthe amount of internal voltages that may be output by power supplysystem 402.

In some embodiments, the diameter of the power interconnecting structuremay depend on the number of the at least one semiconductor die. Forexample, the larger the number of semiconductor dies stacked on thepower supply system 402, the larger the diameter of the correspondingTSV 403 may be. The higher the layer of the semiconductor dies to whichthe TSVs 403 need to transmit the signal, the greater the voltage dropwill be. In this case, the voltage drop may be decreased by increasingthe diameter of the TSVs 403 or the number of TSVs 403 connected inparallel, so that the values of the same internal voltage received bythe respective layers of the semiconductor dies may be substantially thesame.

In the embodiment shown in FIG. 5, each TSV 403 may have a diameter of,for example, about 20 μm and may be arranged at a pitch of about 50 μm,which is sufficient to prevent short-circuit failure between adjacentTSVs. However, the diameters and pitches can be reduced with thepossible development of TSV technology.

Referring to FIG. 5, the semiconductor package structure may furtherinclude: a signal interconnecting structure 404, which may be configuredto input external control signals (e.g., Address, Command, etc.) to eachof the semiconductor dies and/or input data signal (e.g., DQ [0-15]) toor output data signal (e.g., DQ [0-15]) from each of the semiconductordies through the package substrate 401. In the embodiment of the presentdisclosure, the signal interconnecting structure 404 may also be a TSV.

In the embodiment shown in FIG. 5, each of the semiconductor dies A-Dand the power supply system 402 may share a ground power source (notshown) provided by the package substrate 401.

In some embodiments, a package size of the power supply system may beless than or equal to a package size of each of the semiconductor dies.

For example, in the embodiments shown in FIGS. 4 and 5, the package sizeof the power supply system 402 may be smaller than the package size ofeach of the semiconductor dies A-D.

FIG. 6 is a schematic structural diagram of a power supply system inaccordance with one embodiment of the present disclosure.

As shown in FIG. 6, this disclosure provides a power supply system 600.The power supply system 600 may include an internal voltage generatingcircuit 610, which may be configured to generate at least one internalvoltage. The at least one internal voltage may be provided to at leastone semiconductor die (such as the DRAM die in the aforementionedembodiments, but the disclosure is not limited thereto) through a powerinterconnecting structure (such as TSV or bonding wire).

In some embodiments, the internal voltage generating circuit 610 mayinclude at least one voltage regulator configured to generate the atleast one internal voltage.

In some embodiments, the at least one voltage regulator may include afirst charge pump circuit, a second charge pump circuit, a third chargepump circuit, a first low dropout linear regulator, a second low dropoutlinear regulator and a third low dropout linear regulator. The firstcharge pump circuit, the second charge pump circuit and the third chargepump circuit may be configured to output, respectively, a first internalvoltage, a second internal voltage, and a third internal voltageaccording to an external voltage. The first low dropout linearregulator, the second low dropout linear regulator and the third lowdropout linear regulator may be configured to output, respectively, afourth internal voltage, a fifth internal voltage, and a sixth internalvoltage according to the external voltage. The first internal voltagemay be larger than the external voltage, the second internal voltage andthe third internal voltage may both be opposite to the external voltagein polarity. The fourth internal voltage, the fifth internal voltage andthe sixth internal voltage may each be less than or equal to theexternal voltage.

In some embodiments, a Low Dropout Regulator (LDO) may use a transistoror a Field Effect Transistor (FET) operating in its linear region tosubtract the excess from the applied input voltage to produce aregulated output voltage. LDO has outstanding advantages in that it iscost-effective, and has little noise or quiescent current. Moreover, LDOrequires very few external components. For example, a LDO usually onlyrequires one or two bypass capacitors. Thus a LDO may achieve highefficiency in cases in which the input voltage and the output voltageare very close. In such cases, the input current of the LDO issubstantially equal to the output current. If the voltage drop (thedifference between the output voltage and the input voltage) is large,the energy consumed by the LDO may be large and the efficiency maydeteriorate. In other embodiments, the LDO in the embodiment of thepresent disclosure may also be replaced by a DC-DC converter accordingto actual needs.

In the embodiment shown in FIG. 6, as an example, the semiconductor diesmay be DRAM dies, and it is assumed that each layer of the DRAM diesrequires six internal voltages, which are Vp, Vbb, Vnwl, Vcore, Vplt,and Veq. The at least one voltage regulator may include a first chargepump circuit 611, a second charge pump circuit 612, a third charge pumpcircuit 613, a first low dropout linear regulator 614, a second lowdropout linear regulator 615, and a third low dropout linear regulator616. The first charge pump circuit 611 may be configured to output thefirst internal voltage Vp according to the external voltage Vext. Thesecond charge pump circuit 612 may be configured to output the secondinternal voltage Vbb according to the external voltage Vext. The thirdcharge pump circuit 613 may be configured to output the third internalvoltage Vnwl according to the external voltage Vext. The first lowdropout linear regulator 614 may be configured to output a fourthinternal voltage Vcore according to the external voltage Vext. Thesecond low dropout linear regulator 615 may be configured to output thefifth internal voltage Vplt according to the external voltage Vext. Thethird low dropout linear regulator 616 may be configured to output thesixth internal voltage Veq according to the external voltage Vext.

In some embodiments, the first internal voltage Vp may be larger thanthe external voltage Vext, and the second internal voltage Vbb and thethird internal voltage Vnwl may be opposite to the external voltage Vextin polarity. For example, these voltages may have the following values:Vext=1.2V, Vp=3.0V, Vbb=−0.5V, Vnwl=−0.3V. The above voltage values arefor illustrative purposes only, and the disclosure is not limitedthereto.

It should be noted that when the input voltage is opposite to the outputvoltage in polarity, the inverter in the corresponding charge pump canconvert the input positive voltage into the output negative voltage.

In some embodiments, the fourth internal voltage Vcore, the fifthinternal voltage Vplt, and the sixth internal voltage Veq may each beless than or equal to the external voltage Vext. For example, thesevoltages may have the following values: Vext=1.2V, Vcore=1.0V, andVplt=Veq=0.5V. The disclosure is not limited thereto though.

In some embodiments, the at least one voltage regulator may include afirst low dropout linear regulator, a first charge pump circuit, asecond charge pump circuit, a second low dropout linear regulator, athird low dropout linear regulator and a fourth low dropout linearregulator. The first low dropout linear regulator, the second lowdropout linear regulator, the third low dropout linear regulator and thefourth low dropout linear regulator may be configured to output,respectively, a first internal voltage, a fourth internal voltage, afifth internal voltage and a sixth internal voltage according to anexternal voltage. The first charge pump circuit and the second chargepump circuit may be configured to output, respectively, a secondinternal voltage and a third internal voltage according to the externalvoltage. The first internal voltage, the fourth internal voltage, thefifth internal voltage and the sixth internal voltage may each be lessthan or equal to the external voltage. Both the second internal voltageand the third internal voltage may be opposite to the external voltagein polarity.

Taking FIG. 6 as an example, assuming that each layer of thesemiconductor dies requires six internal voltages, which are Vp, Vbb,Vnwl, Vcore, Vplt, and Veq. The at least one voltage regulator mayinclude the first low dropout linear regulator 611, the first chargepump circuit 612, the second charge pump circuit 613, the second lowdropout linear regulator 614, the third low dropout linear regulator615, and the fourth low dropout linear regulator 616. The first lowdropout linear regulator 611 may be configured to output the firstinternal voltage Vp according to the external voltage Vext. The firstcharge pump circuit 612 can be configured to output a second internalvoltage Vbb according to the external voltage Vext. The second chargepump circuit 613 can be configured to output a third internal voltageVnwl according to the external voltage Vext. The second low dropoutlinear regulator 614 can be configured to output a fourth internalvoltage Vcore in accordance with the external voltage Vext. The thirdlow dropout linear regulator 615 may be configured to output the fifthinternal voltage Vplt according to the external voltage Vext. The fourthlow dropout linear regulator 616 may be configured to output the sixthinternal voltage Veq according to the external voltage Vext.

In some embodiments, the first internal voltage Vp, the fourth internalvoltage Vcore, the fifth internal voltage Vplt and the sixth internalvoltage Veq each may be less than or equal to the external voltage Vext.For example, these voltages may have the following values: Vext>3.3V,Vp=3.0V, Vcore=1.0V, Vplt=Veq=0.5V. The second internal voltage Vbb andthe third internal voltage Vnwl may each be opposite to the externalvoltage Vext in polarity. For example, these voltages may have thefollowing values: Vext>3.3V, Vbb=−0.5V, Vnwl=−0.3V.

Referring to FIG. 6, the power supply system 600 may further include areference voltage generating circuit 630 that may be configured togenerate the reference voltage Vref.

In the embodiment shown in FIG. 6, each voltage regulator may beconfigured to output, respectively, the first internal voltage Vp, thesecond internal voltage Vbb, the third internal voltage Vnwl, the fourthinternal voltage Vcore, the fifth internal voltage Vplt and the sixthinternal voltage Veq according to the external voltage Vext, thereference voltage Vref and the power enable signal EN.

In the embodiment shown in FIG. 6, the semiconductor package structureincluding the power supply system 600 may further include a signalinterconnecting structure 700. The signal interconnection structure 700may be configured to input external control signals (e.g., the externalvoltage VDD/VDDQ, VSS/VSSQ, the address signal Address, the commandsignal Command, the clock signal CLK or/CLK, etc.) to each of thesemiconductor dies and/or input data signal (e.g., DQ [0-15]) to oroutput data signal (e.g., DQ [0-15]) from each of the semiconductor diesthrough the package substrate (not shown) of the semiconductor packagestructure. In the embodiment of the present disclosure, the signalinterconnecting structure 700 may also be a TSV.

It should be noted that the embodiment shown in FIG. 6 is describedusing an example in which the semiconductor die of the semiconductorpackage structure is a DRAM die. In other embodiments, the semiconductordie of the semiconductor package structure may be other type of die.Correspondingly, the number and type of internal voltages generated bythe internal voltage generating circuit may also be changed accordingly.Similarly, the external control signals and/or data signals provided bythe signal interconnecting structure may also be changed accordingly.

FIG. 7 is a sequence diagram of the power supply system shown in FIG. 6.

As shown in FIG. 7, when only the external voltage Vext is at a highlevel (in this example, for description purpose, assuming Vext is VDD),the internal voltage generating circuit will not work until the powerenable signal EN is also at a high level. When both VDD and EN are at ahigh level, the internal voltage generating circuit begins to work.After a certain delay, the internal voltage generating circuit mayoutput the first internal voltage Vp, the second internal voltage Vbb,the third internal voltage Vnwl, the fourth internal voltage Vcore, thefifth internal voltage Vplt, and the sixth internal voltage Veq,respectively.

Through the power supply system and the semiconductor package structureof the present disclosure, internal voltages needed by each of thesemiconductor dies in the semiconductor package structure may beprovided through a unified power supply system, and the power supplysystem does not need to be integrated in any of the individualsemiconductor die. Thus, the semiconductor dies can be manufactured byadvance fabrication processes, while the power supply system may bemanufactured by a regular process. Therefore, on one hand, theefficiency of the power supply system can be improved since the powersupply system and the semiconductor dies may each be fabricated by amatched fabrication process; and on the other hand, the cost of the DRAMdies fabrication may be reduced as the power supply system does notoccupy the die area inside the DRAM dies.

FIG. 8 is a circuit diagram of a charge pump circuit based on thevoltage Vp of the power supply system shown in FIG. 6. FIG. 9 is asequence diagram of the charge pump circuit based on the voltage Vpshown in FIG. 8. FIG. 10 is a circuit diagram of the generation of thevoltage Vpclk shown in FIG. 8. FIG. 11 is a circuit diagram of thegeneration of the voltage Vpclken shown in FIG. 10.

As shown in FIG. 10, the reference voltage Vref may reach a high levelshortly after the voltage VDD is supplied, the external controller mayprovide the signal EN to enable the charge pump circuit in FIG. 8 towork (i.e., pumping), which may cause the voltage Vp to gradually rise.In FIG. 9, after the voltage Vp reaches the target voltage, thegeneration of the signal Vpclk may stop, causing the charge pump circuitin FIG. 8 to stop working. If the voltage Vp is lower than the targetvoltage, the generation of the voltage Vpclk may begin, causing thecharge pump circuit in FIG. 8 to begin working (i.e., begin pumping).

FIG. 10 shows a voltage Vpclk generating circuit. When the signalVpclken is at a high level, the generating of the voltage Vpclk maystart. When the voltage Vpclken is at a low level, the generation of thevoltage Vpclk may stop. FIG. 11 shows a Vpclken generating circuit inwhich the voltage dividing resistors R1 and R2 can be designed accordingto specific application scenarios.

FIG. 12 is a circuit diagram of a charge pump circuit based on thevoltage Vbb of the power supply system shown in FIG. 6. FIG. 13 is acircuit diagram of a charge pump circuit based on the voltage Vnwl ofthe power supply system shown in FIG. 6. The principle of FIG. 12 andFIG. 13 is substantially the same to that of FIG. 11, and detaileddescriptions are omitted for the sake of conciseness.

FIG. 14 is a circuit diagram of a low dropout linear regulator based onthe voltage Vcore of the power supply system shown in FIG. 6. FIG. 15 isa circuit diagram of a low dropout linear regulator based on the voltageVeq of the power supply system shown in FIG. 6.

Taking FIG. 14 as an example, the low dropout linear regulator may be anoperational amplifier (OP), a positive input of the OP may be coupled toa voltage resulted from division of the voltage Vext, and the value ofthe resistors R3 and R4 can be adjusted according to specificapplication scenarios. The negative input of the OP may be provided witha feedback voltage Vcore, and the voltage Vext supplied to the thirdinput of the OP may be configured for amplification and rectification.

It should be noted that the resistance values of the resistors R3 and R4may be same or different. Similarly, the resistance values of thevoltage dividing resistors R5 and R6 in FIG. 18 may be same ordifferent.

Exemplary embodiments of the power supply system and semiconductorpackage structure disclosed by the present disclosure are describedand/or illustrated in details above. However, embodiments of the presentdisclosure are not limited to the specific embodiments described herein,but rather, the components and/or steps of each embodiment can be usedindependently and separately from the other components and/or stepsdescribed herein. Each component and/or each step of an embodiment mayalso be used in combination with other components and/or steps of otherembodiments. In the herein description or/and illustration of theelements/components/etc., the terms “one”, “the” etc. are used toindicate the presence of one or more elements/components/etc. The terms“comprising”, “including” and “having” are used for open-ended mode,which means additional elements/components or the like can also beprovided or included in addition to the listed elements/components/etc.Moreover, the terms “first” and “second” and the like in the claims andthe description are used only as a mark, not a numerical limit to thecorresponding objects.

While the power supply system and the semiconductor package structureaccording to the present disclosure have been described in terms ofvarious specific embodiments, those skilled in the art will realize thatthe implementation of the present disclosure can be modified within thespirit and scope of the claims.

The invention claimed is:
 1. An electronic device, comprising: at leastone semiconductor die; and a power supply system, comprising: a voltagegenerating circuit configured to generate at least one voltage, whereinthe voltage generating circuit comprises at least one voltage regulatorconfigured to generate the at least one voltage, and wherein the atleast one voltage is provided to the at least one semiconductor diethrough a power interconnecting structure, wherein the at least onevoltage regulator comprises a first charge pump circuit, a second chargepump circuit, a third charge pump circuit, a first low dropout linearregulator, a second low dropout linear regulator, and a third lowdropout linear regulator, wherein the first charge pump circuit, thesecond charge pump circuit and the third charge pump circuit areconfigured to output, respectively, a first voltage, a second voltageand a third voltage according to an external voltage, the first lowdropout linear regulator, the second low dropout linear regulator, andthe third low dropout linear regulator are configured to output,respectively, a fourth voltage, a fifth voltage, and a sixth voltageaccording to the external voltage, and wherein the first voltage islarger than the external voltage, the second voltage and the thirdvoltage are both opposite to the external voltage in polarity, and thefourth voltage, the fifth voltage, and the sixth voltage are each lessthan or equal to the external voltage.
 2. The device of claim 1, whereinthe at least one voltage is an internal voltage for the at least onesemiconductor die.
 3. The device of claim 1, wherein the at least onesemiconductor die comprises a plurality of semiconductor dies stackedover each other.
 4. The device of claim 1, wherein the power supplysystem further comprises: a reference voltage generating circuitconfigured to generate a reference voltage, wherein the at least onevoltage regulators are configured to output, respectively, the firstvoltage, the second voltage, the third voltage, the fourth voltage, thefifth voltage, and the sixth voltage according to the external voltage,the reference voltage, and a power enable signal.
 5. An electronicdevice, comprising: at least one semiconductor die; and a power supplysystem, comprising: a voltage generating circuit configured to generateat least one voltage, wherein the voltage generating circuit comprisesat least one voltage regulator configured to generate the at least onevoltage, and wherein the at least one voltage is provided to the atleast one semiconductor die through a power interconnecting structure,wherein the at least one voltage regulator comprises a first low dropoutlinear regulator, a first charge pump circuit, a second charge pumpcircuit, a second low dropout linear regulator, a third low dropoutlinear regulator, and a fourth low dropout linear regulator, wherein thefirst low dropout linear regulator, the second low dropout linearregulator, the third low dropout linear regulator, and the fourth lowdropout linear regulator are configured to output, respectively, a firstvoltage, a fourth voltage, a fifth voltage and a sixth voltage accordingto an external voltage, the first charge pump circuit and the secondcharge pump circuit are configured to output, respectively, a secondvoltage and a third voltage according to the external voltage, andwherein the first voltage, the fourth voltage, the fifth voltage, andthe sixth voltages are each less than or equal to the external voltage,the second voltage and the third voltage are both opposite to theexternal voltage in polarity.
 6. The device of claim 5, wherein thepower supply system further comprises: a reference voltage generatingcircuit configured to generate a reference voltage, wherein the at leastone voltage regulators are configured to output, respectively, the firstvoltage, the second voltage, the third voltage, the fourth voltage, thefifth voltage, and the sixth voltage according to the external voltage,the reference voltage, and a power enable signal.
 7. A semiconductorpackage structure, comprising: a package substrate; and the electronicdevice of claim 1, wherein the power supply system of the electronicdevice and the at least one semiconductor die of the electronic deviceare disposed on the package substrate.
 8. The semiconductor packagestructure of claim 7, wherein the at least one semiconductor diecomprises a plurality of semiconductor dies, each of the plurality ofsemiconductor dies having a same electrical function.
 9. Thesemiconductor package structure of claim 8, wherein the plurality ofsemiconductor dies are memory dies.
 10. The semiconductor packagestructure of claim 9, wherein the plurality of semiconductor dies aredynamic random-access memory (DRAM) dies.
 11. The semiconductor packagestructure of claim 8, wherein the plurality of semiconductor dies arestacked vertically on the power supply system.
 12. The semiconductorpackage structure of claim 11, wherein the power interconnectingstructure comprises a through silicon via (TSV).
 13. The semiconductorpackage structure of claim 8, wherein the plurality of semiconductordies is individually disposed on the package substrate directly, and thepower supply system is directly disposed on the package substrate. 14.The semiconductor package structure of claim 13, wherein the powerinterconnecting structure comprises a metal wire.
 15. The semiconductorpackage structure of claim 8, wherein the plurality of semiconductordies are vertically stacked on the package substrate, and the powersupply system is directly disposed on the package substrate.
 16. Thesemiconductor package structure of claim 7, wherein a diameter of thepower interconnecting structure depends on a number of the at least onesemiconductor die.
 17. The semiconductor package structure of claim 7,further comprising: a signal interconnecting structure, wherein thesignal interconnecting structure is configured to input an externalcontrol signal to each of the at least one semiconductor die and/orinput a data signal to or receive a data signal from each of the atleast one semiconductor die through the package substrate.
 18. Thesemiconductor package structure of claim 7, wherein each of the at leastone semiconductor die and the power supply system share a ground powersource provided by the package substrate.
 19. The semiconductor packagestructure of claim 7, wherein a package size of the power supply systemis smaller than or equal to a package size of each of the at least onesemiconductor die.
 20. A semiconductor package structure, comprising: apackage substrate; and the electronic device of claim 5, wherein thepower supply system of the electronic device and the at least onesemiconductor die of the electronic device are disposed on the packagesubstrate.